Sn63/Pb37, No Clean, 0.81mm/0.032" Dia. (mg_4865-454G)

The 4860–4867 Sn63/Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.Manufacturer:MG ChemicalsProduct Category:SolderRoHS:NoProduct:SolderType:WireAlloy:Sn63/Pb37Description/Function:No clean leaded solderDiameter:0.032 inCore Size:2.2 %Contains Lead:YesPackage Type:SpoolFactory Pack Quantity:2Weight:1 lbUnit Weight:1 lb